DMS strain measurement (strain gauge application) on printed circuit boards according to IPC/JEDEC-9704A
Printed circuit boards and other electronic assemblies are exposed to a wide variety of stresses during their life cycle. Particularly in manufacturing and assembly, strain and bending stresses lead to systemic board failures, resulting in field failures and high scrap rates.
Strain Measurement Online Inquiry
As a specialist for strain gage strain measurements on printed circuit boards, we determine for you the actual occurring stress or strain (also strain-rate) on a specific or several components in the manufacturing or assembly process by applying strain gages. Our strain gage measurements are performed using certified measurement technology and according to the specifications of IPC/JEDEC-9704A.
Accurate knowledge of the mechanical bending stress that occurs during assembly or depaneling enables optimization of manufacturing parameters and thus a reduction in scrap during production. The same applies to the assembly of the modules.
IPC/JEDEC-9704A makes clear specifications regarding permissible strain rates and the procedure for measuring stress using strain gauges and calculating board strain. With our help, you can comply with the standard and improve your manufacturing processes.
OUR OPPORTUNITIES, YOUR ADVANTAGES
- DMS measurements (strain gage application) on-site and in our test laboratory
- Performance to IPC/JEDEC-9704A
- Certified measurement technology
- Quick results presented in a comprehensive report (upon request)
- Subsequent consultation and discussion of results (on request)
JUST SEND US YOUR INQUIRY
If you are interested in our services, you can simply send us your inquiry by email, or you can call us. We will then be happy to send you an appropriate quote, or get in touch with you if there is still a need for consultation. Let’s go…
You need a signed confidentiality agreement in advance? No problem. Just send us your standard sample for review, or ask us for our non-disclosure form.
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