On April 20, 2017, Federal Research Minister Johanna Wanka visited TEPROSA in order to gain deeper insights into the manufacture of molded interconnect devices (MID). After managing director Markus Barth has lead her through the production facilities, Wanka produced a component herself. The minister successfully initiated the laser direct structuring process. Andreas Brose, Project Manager of 3D-MID Technology at TEPROSA, assisted and explained the manufacturing challenges of molded interconnected devices in detail. Finally, she received a rather not seriously meant certificate for successfully completing the „3D-MID” module.