MICROSECTIONS AND MICROSCOPIC RECORDS

MICROSECTIONS AND MICROSCOPIC RECORDS

As a laboratory service provider, we offer micrographs and microscopic images of, among other things, electronic assemblies, crimp connections, joints and plated-through holes. We are happy to produce the corresponding micrographs after close consultation with you and evaluate the recordings according to the criteria agreed with you and appropriate test plan. We carry out the investigation of the cuts in our in-house laboratory and then provide you with a comprehensive test report. In the evaluation, you benefit from our years of experience in development, production and validation. If desired, we can also offer you further examinations such as X-ray examinations, shear or withdrawal tests.

 

YOUR ADVANTAGES

  • Fast processing of your sample and creation of a meaningful test report
  • Assessment possible on the basis of agreed criteria
  • Further examinations and advice regarding damage prevention at TEPROSA possible

EASILY SEND US YOUR INQUIRY DATA

Just send us your data and mark the desired cutting planes. We will gladly send you an appropriate offer, or contact you if there is any need for clarification. Here we go…

 

FURTHER TESTS

In our testing laboratory, we can perform X-ray, SEM and EDX analyzes in addition to microsection and microscopic images. Also complete component validation or qualification according to standard, specifications or customer specification are part of our portfolio. In order to support you in the investigation of damage cases and field failures and their avoidance, we are gladly after the damage & component analysis also in case of a correction loop of your electronics available and can take over on request individual design optimizations or the complete redesign.

 

Microsection-of-a-MLCC-Ceramic-Capacitor-Multilayer
Microsection-of-a-MLCC-Ceramic-Capacitor-Multilayer
Cut-out-microsection-BGA-on-3d-MID-component
Cut-out-microsection-BGA-on-3d-MID-component
Microsection-of-a-MLCC-Ceramic-Capacitor-Multilayer
Cut-out-microsection-BGA-on-3d-MID-component

 

YOUR CONTACT PERSON

Dr.-Ing. Sören Majcherek

Managing Director
soeren.majcherek@teprosa.de
0049 (0)391 838 177 94

Kontakt
Tel 0391 598184 70
Teprosa – technology + Engineering

Paul-Ecke-Str. 6
39114 Magdeburg
Deutschland

Tel 0391 598184 70
anfrage@teprosa.de

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