TEPROSA presents possibilities of 3D-MID technology at Productronica 2017

Magdeburg, October 2017 – Productronica in Munich is considered as the world’s largest trade fair for development and production of electronics. November 14 – 17, 2017, at the pavilion of the 3-D MID e.V. (stand 381 in hall B3), TEPROSA together with the other exhibitors will present solutions, possibilities and advantages that 3D-MID offers as a technology in production of three-dimensional circuit carriers. Interested companies can request a free entrance ticket for the fair at anfrage@teprosa.de.

“To provide the broadest overview, there will be several topics that map the entire production process with 3D-MID,” explains Markus Barth, Managing Director of TEPROSA GmbH. This includes the focus on service/ design/ material, basic body manufacturing, circuit path generation, assembly and packaging, prototyping and various application examples.

3D-MID – three-dimensional “Future of Printed Circuit Board”
In principle, mechanical components and electronics are merged with the 3D-MID. By reducing a number of components, products can be miniaturized while increasing their functionality. The great freedom of design opens up many possible applications. At the same time assembly costs are reduced. The technology of the three-dimensional circuit carrier is by no means an alternative, but rather an addition to the classic, two-dimensional circuit board.

At the pavilion, TEPROSA and other service providers present various methods to produce injection-molded, multifunctional, spatial circuit carriers. “We always feel the uncertainty of customers regarding availability of 3D-MID service providers on the market, but now there are experienced and internationally successful providers for all kinds of procedures.”

TEPROSA itself offers production of Molded Interconnect Devices (MID) using LDS and subtractive methods. LDS stands for the process developed by LPKF using laser direct structuring. Both technologies are laser-based and offer a high degree of flexibility and accuracy. MID projects in TEPROSA begin with recommendations regarding requirements for specific applications. After reconciliation of all details, a quotationis created for feasibility study and for later serial production. During the feasibility study, the optimal process parameters will be evaluated, which will enable economic mass production. Prototypes can also be produced as part of the feasibility study. When a project goes into production, TEPROSA organizes a complete supply chain.

To learn more about TEPROSA, you can watch a new corporate video at https://youtu.be/AVZXtRePjvw

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